Digital Image Correlation
Measure full-field displacement, deformation, vibration, and strain using synchronized high-speed imaging and non-contact optical analysis.
Full-Field Optical Measurement
Digital Image Correlation, commonly called DIC, is a two-dimensional or three-dimensional optical tracking technique used to measure deformation, displacement, vibration, and strain.
DIC software follows a random gray-value or speckle pattern across sequential images. As the specimen moves or deforms, the software calculates how small image subsets shift, producing visual maps and quantitative measurement data.
2D and 3D DIC Systems
The camera configuration depends on whether motion remains within a single plane or includes out-of-plane movement and three-dimensional shape change.
2D Digital Image Correlation
A single high-speed camera measures in-plane movement when the specimen surface remains parallel to the image sensor.
- In-plane displacement and strain
- Simpler calibration and alignment
- Ideal for flat or constrained specimens
- Reduced equipment and setup requirements
3D Digital Image Correlation
Two synchronized, calibrated cameras view the specimen from different angles to measure three-dimensional surface movement and shape.
- In-plane and out-of-plane displacement
- Three-dimensional strain and deformation
- Useful for bending, twisting, impact, and buckling
- Requires precise synchronization and calibration
DIC Testing Applications
DIC can be used on metals, rubber, glass, plastics, composites, biological materials, and complete engineered structures.
Deformation & Strain
Measure local and global deformation, strain concentration, necking, yielding, and permanent shape change.
Vibration & Motion
Track transient vibration, mode shapes, oscillation, displacement, deflection, and dynamic structural response.
Impact & Failure
Capture rapid deformation, crack initiation, rupture, delamination, buckling, crushing, and energy absorption.
Common DIC Test Types
High-speed DIC extends traditional optical measurement to rapidly changing and destructive tests.
Tensile Testing
Measure elongation, necking, strain localization, crack initiation, and rupture across the specimen surface.
Torsion Testing
Track twisting, shear strain, angular displacement, surface distortion, and failure under rotational loading.
Bending & Flexure
Measure deflection, curvature, tensile and compressive strain, crack growth, and dynamic bending response.
Load Testing
Correlate full-field motion and strain with applied force, pressure, torque, or structural loading.
Drop & Impact Testing
Analyze displacement, component movement, contact deformation, rebound, fracture, and energy transfer.
Composite Failure
Visualize delamination, fiber failure, matrix cracking, interface separation, and progressive structural damage.
Typical DIC Workflow
A successful DIC test depends on surface preparation, camera geometry, calibration, synchronized recording, illumination, and post-processing.
Virtual Engineering Laboratory
Wichita State University’s National Institute for Aviation Research uses Photron high-speed cameras in its Virtual Engineering Laboratory to record high-impact dynamic events that occur too quickly for the human eye to follow.
Discuss a high-speed DIC system →Selecting a Camera for DIC
Camera choice affects spatial resolution, temporal resolution, image sharpness, measurement accuracy, stereo synchronization, and the quality of the final strain data.
Need help configuring a DIC system?
Share your test speed, specimen size, field of view, strain requirements, camera count, and DIC software with Photron.